Technology & Equipment
DYMET technology may be applied to ceramic plates metallization.
Metal masks are used for local areas metallization.
Process automation is necessary to deposit uniform coating layer.
Aluminum sublayer ensures the coating bond strength 30 - 40 MPa. The sublayer is sprayed by K-10-04 powder at temperature mode "1" or "2".
Spray copper layer by K-01-01 powder at temperature mode "2" - "4".
Hard-drawn copper coating has reduced electric conductivity. Annealing is necessary to achieve the conductivity of 2.4*10-6 Ohm*cm.